100G SOLDER FLUX SOLDER PASTE FOR BGA REBALLING REWORK IN SOUTH AFRICA
Volume: 100g It can be used for PCB, BGA, PGA reworking, soldering and reballing of computer and phone chips. Excellent capacity of solder stickiness. Excellent Anti wet Capacity. Widely used on BGA, PGA, CSP packages and flip chip operation. Suitable for multiple PCB reflow. No-clean and Lead free for environmental protection. Package included: 1 x Solder Flux Solder Paste Details pictures:
4.00/5
1 reviews
Price:
R 0,00
R 0,00
Contact
CONTACT