Intel thermal solution cooling

We are currently closed until 9 January. Your order will be processed as soon as we re-open Item is expected to be in stock, however stock levels are LOW, so stock may be finished. If ordered, we will contact you if this product is sold out FEATURES Technical Information: With fan Installed:Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink With fan removed:Pedestal chassis with ducted airflow to heat sink;2U or larger rack chassis with ducted airflow to heat sink Compatibility:Intel Xeon processors,Intel LGA2011 socket Application:Processor PRODUCT SPECIFICATIONS Manufacturer: Intel Product Category: CPU & Chip Coolers Dimensions: 91.5 mm L x 91.5 mm W x 64 mm H Operating Supply Voltage: 6 V to 13.8 V Power Rating: 130 W Airflow: 26 CFM Brand: Intel Current Type: DC Height: 64 mm Length: 91.5 mm Packaging: Bulk Product: Chip Coolers Termination Style: Wire Leads Thickness: - Width: 91.5 mm Part # Aliases: 915970

Intel Thermal Solution DRX-A Socket Intel Thermal Solution DRX-A Socket Please note: This product is not in stock with us and will need to ordered from our suppliers. Current stock status: dispatched in 1-3 working days (The stipulated shipping time is how long the product will take to reach us before we send it to you. Please note that we DO NOT keep stock of this item, and order from our suppliers as needed. Because of this stock discrepancies may arise i.e. a product is out of stock with our suppliers.)We strive to ensure every transaction results in a positive rating on both sides. If there is anything you are not satisfied about please contact us.  

Intel Active Thermal Solution TS15A Supports the LGA 1151/1156/1150

Buy Intel Active Thermal Solution TS15A supports 130 W Processors for R568.00

Intel Liquid Cooling Solution | BXTS13X Brand New & Sealed * Original Product * Valid Manufacturer's Guarantee * Fast Delivery Intel Product Code: BXTS13X Availability: 9 in Stock Updated cooler block Supports 130 W processors Low-profile pump Blue LED lighting with on/off switch Overview If you are into extreme gaming and overclocking, the Intel Thermal Solution TS13X (liquid cooling) is the perfect fit. It is designed for all high-end desktop performance overclocking. Specifications Product Description Intel Liquid Cooling Solution TS13X - liquid cooling system CPU heat exchanger with integrated pump Product Type Liquid cooling system CPU heat exchanger with integrated pump Compatibility LGA Socket, LGA Socket, LGA Socket, LGA Socket, LGA Socket Manufacturer Warranty 3 years warranty Delivery & FAQ's * Metropolitan Areas - Delivery of this item within 3 business days after payment reflects * Outlying Areas - Please allow 5 business days after payment reflects for delivery of this item This item carries a vaild manufacturers warranty/guarantee. Manufacturer's Code: BXTS13X Intel

Intel BXTS13X Liquid Cooling Thermal Solution Heat sink/Radiator for Socket LGA1150/ LGA2011 / LGA1366 / LGA1156 / LGA1155, Retail Box, 1 year Limited Warranty Product Overview Intel introduces its second generation liquid cooling solution with the BXTS13X. It uses patented technology to provide high performance cooling in an easy to install unit. The Intel BXTS13X consists of a combined heat sink with a liquid pump and a radiator. The heat sink is compatible with CPU¿s using the LGA 2011, LGA 1150, LGA 1155, LGA 1156 and LGA1366 sockets. The small unit circulates water keeping the CPU cool when it is idling and when it is under full load. It automatically adjusts the rate of cooling according to CPU temperature. Liquid cooling not only keeps the CPU cool it allows you to mount the high performance radiator and speed adjustable 120mm x 120mm high flow fan to ensure that the heat is directed outside your case. This helps to keep all of your other components cooler increasing reliability. The pre-filled and sealed unit requires no maintenance and has a MTBF of 50,000 hours. Specifications ¿ Stock Code BXTS13X ¿ Brand Name Intel ¿ Product Name Intel TS13X Liquid Cooling Solution ¿ Form Factor -Case Fan with Radiator ¿ Package Type Retail ¿ Connectors 4 Pin Fan Connector ¿ Fan Diameter -120mm ¿ Height Radiator and Fan 52mm ¿ Fan Speed Variable rpm ¿ Fan Bearing Type -Riffle Bearing ¿ Number of Fans 1 ¿ Rated Voltage 12 VDC ¿ Rated Wattage 2.4 Watts (min) ¿ Rated Amps.5 Amps ¿ Life 50000 hours ¿ Rated Air Flow 47.27 CFM ¿ Dimensions -Width 120mm x Depth120mm ¿ Weight (Approximate)820g Application/Usage Intel CPU Cooling ¿ LGA 2011 socket CPU's ¿ LGA 1150 socket CPU's ¿ LGA 1155 socket CPU's ¿ LGA 1156 socket CPU's ¿ LGA 1366 socket CPU's Package Contents ¿ 1 x 120 mm 7 Blade Fan ¿ 1 x Radiator and Cooler Pump Assembly ¿ 1 x 4 Pin Electrical Connector ¿ 1 x Set Fan/Radiator Mounting Hardware

Intel BXTS13X Liquid Cooling Thermal Solution Heat sink/Radiator for Socket LGA1150/ LGA2011 / LGA1366 / LGA1156 / LGA1155, Retail Box, 1 year Limited Warranty Product Overview Intel introduces its second generation liquid cooling solution with the BXTS13X. It uses patented technology to provide high performance cooling in an easy to install unit. The Intel BXTS13X consists of a combined heat sink with a liquid pump and a radiator. The heat sink is compatible with CPU’s using the LGA 2011, LGA 1150, LGA 1155, LGA 1156 and LGA1366 sockets. The small unit circulates water keeping the CPU cool when it is idling and when it is under full load. It automatically adjusts the rate of cooling according to CPU temperature. Liquid cooling not only keeps the CPU cool it allows you to mount the high performance radiator and speed adjustable 120mm x 120mm high flow fan to ensure that the heat is directed outside your case. This helps to keep all of your other components cooler increasing reliability. The pre-filled and sealed unit requires no maintenance and has a MTBF of 50,000 hours. Specifications • Stock Code BXTS13X • Brand Name Intel • Product Name Intel TS13X Liquid Cooling Solution • Form Factor -Case Fan with Radiator • Package Type Retail • Connectors 4 Pin Fan Connector • Fan Diameter -120mm • Height Radiator and Fan 52mm • Fan Speed Variable rpm • Fan Bearing Type -Riffle Bearing • Number of Fans 1 • Rated Voltage 12 VDC • Rated Wattage 2.4 Watts (min) • Rated Amps.5 Amps • Life 50000 hours • Rated Air Flow 47.27 CFM • Dimensions -Width 120mm x Depth120mm • Weight (Approximate)820g Application/Usage Intel CPU Cooling • LGA 2011 socket CPU's • LGA 1150 socket CPU's • LGA 1155 socket CPU's • LGA 1156 socket CPU's • LGA 1366 socket CPU's Package Contents • 1 x 120 mm 7 Blade Fan • 1 x Radiator and Cooler Pump Assembly • 1 x 4 Pin Electrical Connector • 1 x Set Fan/Radiator Mounting Hardware

Intel Mini PC - NUC Kit DETYKHE         The Intel® NUC Kit DETYKHE, built with an Intel® Atom™ processor for intelligent systems, is a pint-sized powerhouse for value-conscious businesses and organizations. This low-cost, low-power solution introduces many firsts to the Intel NUC form-factor: fanless thermal solution for the ultimate silence and reliability, onboard flash storage for small-footprint software solutions, internal flat panel display connectivity for built-in screens, video graphics array (VGA) port for monitor compatibility in legacy installations, serial ports header for peripherals requiring the robustness of hardware handshaking, watchdog timer for resilient system availability, and also inter-integrated circuit (I²C) and pulse width modulation (PWM) signals for interfacing with sensors and other embedded devices enabling the Internet of Things. And with its three-year supply availability, the Intel NUC Kit DETYKHE will be around to support long development and production ramp cycles. Specifications: Processor Intel® Atom  processor E GHz single core, 512 KB cache, 5 W thermal design power (TDP))   Memory DDR3L SO-DIMM 1.35V, MHz (down clocked to MHz), 8 GB maximum   Graphics Intel® HD Graphics (up to 400 MHz) 1x HDMI* 1.4a 1x Embedded DisplayPort* (eDP) 1.3 (2 lanes with backlight and adjustable voltage/timings) 1x VGA   Audio Multi-channel digital audio via HDMI interface Back panel headphone/microphone jack   Peripheral connectivity 1x USB 3.0 connector on the front panel 2x USB 2.0 connectors on the back panel 3x internal USB 2.0 ports (2x5 + 1x5 headers)   Storage 4-GB eMMC storage device built in Internal support for 2.5-inch HDD or SSD (up to 9.5mm thickness)   Networking Mbps Ethernet port Half-length PCIe* mini-card slot and wireless antennas pre-assembled (for wireless card support)   Enclosure Metallic gray plastic ring with black sides Dimensions: 190mm x 116mm x 40mm   Power adapter 12V, 36W wall-mount AC-DC power adapter  (power adapter not included)  (V DC back panel power connector) Multi-country plugs (IEC types A/C/G/I)   Warranty 3-year limited warranty

Intel Core i5-6500 3.2 GHz Quad Core 14nm Skylake Socket 1151 Desktop CPU Specifications: Essentials: - Status Launched - Launch Date Q3'15 - Processor Number i5-6500 - Intel Smart Cache 6 MB - DMI3 8 GT/s - Instruction Set 64-bit - Instruction Set Extensions SSE4.1/4.2, AVX 2.0 - Embedded Options Available Yes - Lithography 14 nm - Scalability 1S Only - Thermal Solution Specification PCG 2015C (65W) Performance - # of Cores 4 - # of Threads 4 - Processor Base Frequency 3.2 GHz - Max Turbo Frequency 3.6 GHz - TDP 65 W Memory Specifications: - Max Memory Size (dependent on memory type) 64 GB - Memory Types DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V - Max # of Memory Channels 2 - Max Memory Bandwidth 34.1 GB/s - ECC Memory Supported No Graphics Specifications: - Processor Graphics Intel HD Graphics 530 - Graphics Base Frequency 350 MHz - Graphics Max Dynamic Frequency 1.05 GHz - Graphics Video Max Memory 1.7 GB - Graphics Output eDP/DP/HDMI/DVI - 4K Support Yes, at 60Hz - Max Resolution (Intel WiDi) 1080p - Max Resolution (HDMI 1.4) 4096x2304@24Hz - Max Resolution (DP) 4096x2304@60Hz - Max Resolution (eDP - Integrated Flat Panel) 4096x2304@60Hz - Max Resolution (VGA) N/A - DirectX* Support 12 - OpenGL* Support 4.4 - Intel Quick Sync Video Yes - Intel InTru 3D Technology Yes - Intel Insider Yes - Intel Wireless Display Yes - Intel Clear Video HD Technology Yes - Intel Clear Video Technology Yes - # of Displays Supported 3 - Device ID 0x1912 Expansion Options: - PCI Express Revision 3 - PCI Express Configurations Up to 1x16, 2x8, 1x8+2x4 - Max # of PCI Express Lanes 16 Package Specifications: - Max CPU Configuration 1 - Package Size 37.5mm x 37.5mm - Graphics and IMC Lithography 14 nm - Sockets Supported FCLGA1151 - Low Halogen Options Available See MDDS Advanced Technologies: - Intel Turbo Boost Technology 2 - Intel vPro Technology Yes - Intel Hyper-Threading Technology No - Intel Virtualization Technology (VT-x) Yes - Intel Virtualization Technology for Directed I/O (VT-d) Yes - Intel VT-x with Extended Page Tables (EPT) Yes - Intel TSX-NI Y Yes - Intel 64 Yes - Idle States Yes - Enhanced Intel SpeedStep Technology Yes - Thermal Monitoring Technologies Yes - Intel Stable Image Platform Program (SIPP) Yes - Intel Small Business Advantage Yes Intel Data Protection Technology: - Intel AES New Instructions Yes - Secure Key Yes Intel Platform Protection Technology: - OS Guard Yes - Trusted Execution Technology Yes - Execute Disable Bit Yes Warranty Information: - Warranty 3 Year Warranty *** Confirm availability before placing your order ***

Intel Next Unit of | BLKDETYKH0E Brand New & Sealed * Original Product * Valid Manufacturer's Guarantee * Fast Delivery Intel Product Code: BLKDETYKH0E Availability: 34 in Stock Designed with thin-client computing in mind Also ideal for embedded applications Overview The Intel NUC DETYKHE built with an Intel Atom processor for intelligent systems, is a pint-sized powerhouse for value-conscious businesses and organizations. This low-cost, low-power solution introduces many firsts to the Intel NUC form-factor: fanless thermal solution for the ultimate silence and reliability, onboard flash storage for small-footprint software solutions, internal flat panel display connectivity for built-in screens, VGA port for monitor compatibility in legacy installations, serial ports for peripherals requiring the robustness of hardware handshaking, watchdog timer for resilient system availability, and also I2C and PWM signals for interfacing with sensors and other embedded devices enabling the Internet of Things. Specifications Product Description Intel Next Unit of Computing Kit DETYKHE - Atom E GHz - 0 MB - 0 GB Type PC barebone Form Factor Mini PC Processor 1 x Intel Atom E GHz Processor Main Features Intel Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Intel AES New Instructions Cache Memory 512 KB Cache Per Processor 512 KB RAM 0 MB (installed) / 8 GB (max) - DDR3L SDRAM Flash Memory 4 GB Storage Controller SATA (SATA 3Gb/s) Hard Drive No HDD Graphics Controller Intel HD Graphics Audio Output Integrated Networking GigE OS Provided No operating system Dimensions (WxDxH) 4 cm x 19 cm x 11.6 cm Manufacturer Warranty 3 years warranty Delivery & FAQ's * Metropolitan Areas - Delivery of this item within 3 business days after payment reflects * Outlying Areas - Please allow 5 business days after payment reflects for delivery of this item This item carries a vaild manufacturers warranty/guarantee. Manufacturer's Code: BLKDETYKH0E Intel

Intel Next Unit of | BLKDETYKH0E Brand New & Sealed * Original Product * Valid Manufacturer's Guarantee * Fast Delivery Intel Product Code: BLKDETYKH0E Availability: 23 in Stock Designed with thin-client computing in mind Also ideal for embedded applications Overview The Intel NUC DETYKHE built with an Intel Atom processor for intelligent systems, is a pint-sized powerhouse for value-conscious businesses and organizations. This low-cost, low-power solution introduces many firsts to the Intel NUC form-factor: fanless thermal solution for the ultimate silence and reliability, onboard flash storage for small-footprint software solutions, internal flat panel display connectivity for built-in screens, VGA port for monitor compatibility in legacy installations, serial ports for peripherals requiring the robustness of hardware handshaking, watchdog timer for resilient system availability, and also I2C and PWM signals for interfacing with sensors and other embedded devices enabling the Internet of Things. Specifications Product Description Intel Next Unit of Computing Kit DETYKHE - Atom E GHz - 0 MB - 0 GB Type PC barebone Form Factor Mini PC Processor 1 x Intel Atom E GHz Processor Main Features Intel Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Intel AES New Instructions Cache Memory 512 KB Cache Per Processor 512 KB RAM 0 MB (installed) / 8 GB (max) - DDR3L SDRAM Flash Memory 4 GB Storage Controller SATA (SATA 3Gb/s) Hard Drive No HDD Graphics Controller Intel HD Graphics Audio Output Integrated Networking GigE OS Provided No operating system Dimensions (WxDxH) 4 cm x 19 cm x 11.6 cm Manufacturer Warranty 3 years warranty Delivery & FAQ's * Metropolitan Areas - Delivery of this item within 3 business days after payment reflects * Outlying Areas - Please allow 5 business days after payment reflects for delivery of this item This item carries a vaild manufacturers warranty/guarantee. Manufacturer's Code: BLKDETYKH0E Intel

Keep your CPU cool and running smoothly by using the Intel BXRTSAC Sandy Bridge-E Air Cooler. This low-cost CPU cooling device is compatible with the latest Intel Sandy Bridge-E processors with an LGA socket and provides a steady flow of air for a much effective cooling performance. Face heavy computing with confidence with the Intel BXRTSAC Sandy Bridge-E Air Cooler. CPU air cooler; it provides a steady airflow to keep your PC running smoothly. LGA socket; compatible with the latest Intel Sandy Bridge-E processors.This thermal solution works with LGA-based 130W processors such as the i, iK, iX, iK, iK, and iX.

Stock Code: BXG StatusLaunched Launch DateQ2'14 Processor NumberG # of Cores2 # of Threads2 Clock Speed2.8 GHz Cache2 MB DMI25 GT/s Instruction Set64-bit Instruction Set ExtensionsSSE Embedded Options Available No Lithography22 nm Scalability1S Only Max TDP54 W Thermal Solution SpecificationPCG C -Memory Specifications Max Memory Size (dependent on memory type)32 GB Memory TypesDDR # of Memory Channels2 Max Memory Bandwidth21.3 GB/s ECC Memory Supported ‡ Yes -Graphics Specifications Processor Graphics ‡Intel® HD Graphics Graphics Base Frequency 350 MHz Graphics Max Dynamic Frequency1.05 GHz Graphics Video Max Memory1 GB Intel® Quick Sync Video Yes Intel® Clear Video HD TechnologyYes # of Displays Supported ‡3 -Expansion Options PCI Express Revision3.0 PCI Express Configurations ‡Up to 1x16, 2x8, 1x8/2x4 Max # of PCI Express Lanes16 -Package Specifications Max CPU Configuration1 TCASE72°C Package Size37.5mm x 37.5mm Graphics and IMC Lithography22 nm Sockets Supported FCLGA Low Halogen Options AvailableSee MDDS -Advanced Technologies Intel® Turbo Boost Technology ‡No Intel® vPro Technology ‡ No Intel® Hyper-Threading Technology ‡ No Intel® Virtualization Technology (VT-x) ‡ Yes Intel® Virtualization Technology for Directed I/O (VT-d) ‡ No Intel® VT-x with Extended Page Tables (EPT) ‡ Yes Intel® TSX-NINo Intel® 64 ‡ Yes Idle StatesYes Enhanced Intel SpeedStep® Technology Yes Thermal Monitoring TechnologiesYes Intel® Virtualization Technology for Itanium (VT-i)No Intel® Stable Image Platform Program (SIPP)No -Intel® Data Protection Technology AES New Instructions No Secure KeyYes -Intel® Platform Protection Technology Trusted Execution Technology ‡ No Execute Disable Bit ‡Yes

Stock Code: BXI StatusLaunched Launch DateQ2'13 Processor Numberi # of Cores2 # of Threads4 Clock Speed3.5 GHz Intel® Smart Cache3 MB DMI5 GT/s Instruction Set64-bit Instruction Set ExtensionsSSE, AVX Embedded Options Available No Lithography22 nm Max TDP55 W Thermal Solution SpecificationC -Memory Specifications Max Memory Size (dependent on memory type)32 GB Memory TypesDDR # of Memory Channels2 Max Memory Bandwidth25.6 GB/s ECC Memory Supported ‡ Yes -Graphics Specifications Processor Graphics ‡Intel® HD Graphics Graphics Base Frequency650 MHz Graphics Max Dynamic Frequency1.05 GHz Intel® Quick Sync Video Yes Intel® InTru™ 3D TechnologyYes Intel® Insider™Yes Intel® Wireless Display Yes Intel® Flexible Display Interface (Intel® FDI)Yes Intel® Clear Video HD TechnologyYes # of Displays Supported ‡3 -Expansion Options PCI Express Revision2.0 PCI Express Configurations ‡up to 1x16, 2x8, 1x8 & 2x4 -Package Specifications Max CPU Configuration1 TCASE65.3°C Package Size 37.5mm x 37.5mm Sockets SupportedFCLGA Low Halogen Options AvailableSee MDDS -Advanced Technologies Intel® Turbo Boost Technology ‡No Intel® vPro Technology ‡ No Intel® Hyper-Threading Technology ‡ Yes Intel® Virtualization Technology (VT-x) ‡ Yes Intel® Virtualization Technology for Directed I/O (VT-d) ‡ No Intel® VT-x with Extended Page Tables (EPT) ‡ Yes Intel® 64 ‡ Yes Intel® My WiFi TechnologyYes Idle StatesYes Enhanced Intel SpeedStep® Technology Yes Thermal Monitoring TechnologiesYes Intel® Identity Protection Technology ‡Yes -Intel® Data Protection Technology AES New Instructions No Secure KeyNo -Intel® Platform Protection Technology Trusted Execution Technology ‡ No Execute Disable Bit ‡Yes Anti-Theft Technology Yes

Stock Code: BXI StatusLaunched Launch DateQ2'14 Processor Numberi # of Cores4 # of Threads4 Clock Speed3.2 GHz Max Turbo Frequency3.4 GHz Intel® Smart Cache6 MB DMI25 GT/s # of QPI Links0 Instruction Set64-bit Instruction Set ExtensionsSSE , AVX 2.0 Embedded Options Available Yes Lithography 22 nm Scalability1S Only Max TDP84 W Thermal Solution SpecificationPCG D -Memory Specifications Max Memory Size (dependent on memory type) 32 GB Memory TypesDDR # of Memory Channels2 Max Memory Bandwidth25.6 GB/s ECC Memory Supported ‡ No -Graphics Specifications Processor Graphics ‡Intel® HD Graphics Graphics Base Frequency350 MHz Graphics Max Dynamic Frequency1.1 GHz Graphics Video Max Memory1 GB Intel® Quick Sync Video Yes Intel® InTru™ 3D TechnologyYes Intel® Insider™Yes Intel® Wireless Display Yes Intel® Clear Video HD TechnologyYes # of Displays Supported ‡3 -Expansion Options PCI Express Revision3.0 PCI Express Configurations ‡Up to 1x16, 2x8, 1x8/2x4 Max # of PCI Express Lanes16 -Package Specifications Max CPU Configuration1 TCASE°C Package Size37.5mm x 37.5mm Graphics and IMC Lithography22nm Sockets Supported FCLGA Low Halogen Options AvailableSee MDDS -Advanced Technologies Intel® Turbo Boost Technology ‡2.0 Intel® vPro Technology ‡ No Intel® Hyper-Threading Technology ‡ No Intel® Virtualization Technology (VT-x) ‡ Yes Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Yes Intel® VT-x with Extended Page Tables (EPT) ‡ Yes Intel® TSX-NINo Intel® 64 ‡ Yes Intel® My WiFi TechnologyYes Idle StatesYes Enhanced Intel SpeedStep® Technology Yes Thermal Monitoring TechnologiesYes Intel® Identity Protection Technology ‡Yes Intel® Stable Image Platform Program (SIPP)No -Intel® Data Protection Technology AES New Instructions Yes Secure KeyYes -Intel® Platform Protection Technology OS GuardYes Trusted Execution Technology ‡ No Execute Disable Bit ‡Yes Anti-Theft TechnologyYes