Thermal solution

Intel Thermal Solution DRX-A Socket Intel Thermal Solution DRX-A Socket Please note: This product is not in stock with us and will need to ordered from our suppliers. Current stock status: dispatched in 1-3 working days (The stipulated shipping time is how long the product will take to reach us before we send it to you. Please note that we DO NOT keep stock of this item, and order from our suppliers as needed. Because of this stock discrepancies may arise i.e. a product is out of stock with our suppliers.)We strive to ensure every transaction results in a positive rating on both sides. If there is anything you are not satisfied about please contact us.  

Intel Active Thermal Solution TS15A Supports the LGA 1151/1156/1150

Buy Intel Active Thermal Solution TS15A supports 130 W Processors for R568.00

We are currently closed until 9 January. Your order will be processed as soon as we re-open Item is expected to be in stock, however stock levels are LOW, so stock may be finished. If ordered, we will contact you if this product is sold out FEATURES Technical Information: With fan Installed:Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink With fan removed:Pedestal chassis with ducted airflow to heat sink;2U or larger rack chassis with ducted airflow to heat sink Compatibility:Intel Xeon processors,Intel LGA2011 socket Application:Processor PRODUCT SPECIFICATIONS Manufacturer: Intel Product Category: CPU & Chip Coolers Dimensions: 91.5 mm L x 91.5 mm W x 64 mm H Operating Supply Voltage: 6 V to 13.8 V Power Rating: 130 W Airflow: 26 CFM Brand: Intel Current Type: DC Height: 64 mm Length: 91.5 mm Packaging: Bulk Product: Chip Coolers Termination Style: Wire Leads Thickness: - Width: 91.5 mm Part # Aliases: 915970

Intel Liquid Cooling Solution | BXTS13X Brand New & Sealed * Original Product * Valid Manufacturer's Guarantee * Fast Delivery Intel Product Code: BXTS13X Availability: 9 in Stock Updated cooler block Supports 130 W processors Low-profile pump Blue LED lighting with on/off switch Overview If you are into extreme gaming and overclocking, the Intel Thermal Solution TS13X (liquid cooling) is the perfect fit. It is designed for all high-end desktop performance overclocking. Specifications Product Description Intel Liquid Cooling Solution TS13X - liquid cooling system CPU heat exchanger with integrated pump Product Type Liquid cooling system CPU heat exchanger with integrated pump Compatibility LGA Socket, LGA Socket, LGA Socket, LGA Socket, LGA Socket Manufacturer Warranty 3 years warranty Delivery & FAQ's * Metropolitan Areas - Delivery of this item within 3 business days after payment reflects * Outlying Areas - Please allow 5 business days after payment reflects for delivery of this item This item carries a vaild manufacturers warranty/guarantee. Manufacturer's Code: BXTS13X Intel

The OS-2130D is a compact direct thermal desktop barcode printer that offers outstanding features and exceptional value. This easy-tooperate printer is ideal for low- to medium-volume printing needs. The OS-2130D is ideal for applications such as pointof-sale, weight scales, mailing, banking, ticketing, patient tracking, kiosks, and document labeling. Key features of the OS-2130D include a USB port, an internal real time clock (RTC) and a buzzer. The USB allows easy connectivity with computers and other devices. The internal RTC facilitates time and date marking for standalone operation. The buzzer provides built-in error warning by beeping when media runs out or paper jams occur. With its easy operation, reliability, and space-saving size, the OS-2130D offers a high performance, cost-effective solution for your barcode and labeling requirements. ● For low to medium volume printing demand ● 2.83-inch(72mm) printing width, direct thermal barcode printer ● 203 dpi print resolution and up to 4ips(102mm/s) printing speed ● 32-bit CPU and 4MB Flash; 8MB SDRAM memory standard ● Communication interfaces –Serial RS-232 (9 pin), USB(2.0), Cash Drawer, Ethernet(Optional) to fit in various systems ● Buzzer for error warning function ● Internal Real Time Clock ● Support Windows 7 ● Tear off bar Built-in

Evolis Badgy100 Card Printing solution, including: 1 Badgy100 card printer, 1 color ribbon for 50 prints, 50 thick PVC cards (0,76mm - 30mil), 1 Evolis Badge Studio software licence, Retail Box, 1 year Limited Warranty Product Overview: The Badgy100 printer is ideally suited to your single printing needs and is perfect for limited budgets. What is more, its printing speed means that you can create a personalized card in less than a minute. With Badgy100, you have everything you need to instantly print professional quality badges yourself. Highlights: • Dye Sublimation / Thermal Transfer • Resolution: 300 dpi • Color YMCKO Print Speed: 80 Cards/Hour • Monochrome Print Speed: 180 Cards/Hour • Works with CR-80 Cards • Single-Sided, Margins of 0.05" • 25 Card Input / 25 Card Output • LED Display & Kensington Lock Slot • USB 2.0 Connectivity • Evolis Badge Studio Software

Point of Sale Equipment for Sale, retail point of sale systems, point of sale peripherals such as a thermal receipt printer, barcode scanner,cash drawer,pos cash register, pole display or software asset management. Barcode scanners. Point of Sale software with training for only R. Point of Sale Repair,

The PRO series motherboards offer stable functionality and high-quality assembly. They not only optimise professional workflows but also reduce troubleshooting and ensure longevity.MSI motherboards offer a wide range of convenient and intelligent designs specifically tailored for DIY users. Additionally, they provide numerous system tuning and troubleshooting tools that allow you to maximise your system’s performance and meet the needs of even the most demanding tweakers. The latest DDR5 memory represents a significant advancement in DDR performance enhancement. MSI PRO Series motherboards are equipped with a dedicated SMT welding process and MSI Memory Boost technology, ensuring exceptional memory performance. Experience lightning-fast speeds with USB 3.2 devices like never before! The MSI PRO Series motherboards provide a diverse range of options for connecting and enhancing your USB devices. They offer unprecedented USB speeds of up to 20Gb/s when utilising the Rear USB Type-C connection. The Extended Heatsink is designed to increase the surface area for heat dissipation, allowing for optimal performance even under heavy loads. The enhanced M.2 thermal solution provides effective protection for M.2 SSDs, ensuring both their safety and exceptional performance. The VRM heatsink is responsible for covering the upper MOS and aiding in the dissipation of heat. The stable performance of all cores running at high speed is ensured by using high-quality 7W/mK MOSFET thermal pads and additional choke thermal pads. The chipset heatsink is specifically designed to minimise the accumulation of dust and reduce noise. Additionally, it effectively dissipates heat, ensuring optimal efficiency. Experience the full potential of maximum performance with a VRM design that boasts a robust 12+1+1 power configuration, ensuring optimal power delivery and sustained efficiency. MSI PRO Series motherboards are equipped with dual power connectors and exclusive Core Boost technology, making them capable of handling demanding daily workloads with ease. The PCB design has been optimised to enhance bandwidth and increase transfer speeds, resulting in improved reliability for circuit transmission. FEATURES: Supports 12th/13th Gen Intel® Core™, Pentium® Gold and Celeron® processors for LGA 1700 socket Supports DDR5 Memory, Dual Channel DDR5 6600+MHz (OC) Enhanced Power Design: 12+1+1 Duet Rail Power System with P-PAK, dual 8-pin CPU power connectors, Core Boost, Memory Boost Premium Thermal Solution: Extended Heatsink, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads and M.2 Shield Frozr are built for high performance system and non-stop gaming experience High-Quality PCB: 6-layer PCB made by 2oz thickened copper and server-grade level material Lightning Fast Game experience: PCIe 5.0 slot, Lightning Gen 4 x4 M.2, USB 3.2 Gen 2×2 Intel Turbo USB 3.2 Gen 2: Powered by Intel USB 3.2 Gen2 controller, Turbo USB ensures an uninterrupted connection with more stability and fastest USB speeds 2.5G LAN with Wi-Fi 6E Solution: Upgraded network solution for professional and multimedia use. Delivers a secure, stable and fast network connection AUDIO BOOST: Reward your ears with studio-grade sound quality for the most immersive gaming experience SPECIFICATIONS: CPU Support: Supports 12th/13th Gen Intel® Core™ Processors, Pentium® Gold and Celeron® Processors LGA 1700 Chipset: INTEL Z790 DDR5 Memory: DDR5 6600+(OC)/ 6400(OC)/ 6200(OC)/ 6000(OC)/ 5800(OC)/ 5600(JEDEC)/ 5400(JEDEC)/ 5200(JEDEC)/ 5000(JEDEC)/ 4800(JEDEC) MHz Max. overclocking frequency: 1DPC 1R Max speed up to 6600+ MHz, 1DPC 2R Max speed up to 6400+ MHz Memory Channel: Dual Channel DDR5 DIMM Slots: 4 Max Memory (GB): 192 PCI-E x16: 2 PCI-E x1: 3 SATA 6G: 4 M.2 Slot: 2 RAID: 0/1/5/10 LAN: Realtek® RTL8125BG 2.5Gbps LAN Power Connector(ATX_PWR): 1 Power Connector(CPU_PWR): 2 CPU Fan: 1 Pump Fan: 1 System Fan: 4 Front Panel (JFP): 2 Chassis Intrusion (JCI): 1 Front Audio (JAUD): 1 Addressable V2 RGB LED connector (JARGB_V2): 2 RGB LED connector(JRGB): 2 TPM pin header(Support TPM 2.0): 1 USB 2.0 ports: 4 USB 3.2 Gen1 Type A ports: 4 Audio ports (Rear): Realtek® ALC897 Codec 7.1-Channel High Definition Audio Bluetooth: 5.3, FIPS, FISMA Wifi: Wi-Fi 6E VGA: 1 HDMI: 1 DisplayPort: 1 DirectX: 12 Form Factor: ATX Operating System: Support for Windows® 11 64-bit and Windows® 10 64-bit WHAT’S IN THE BOX: MSI PRO Z790-S WIFI ATX Gaming Motherboard – Black x1 I/O Shield x1 SATA Cable x1 EZ M.2 Clips x1 Quick Install Guide x1

MSI MPG X670E CARBON WIFI AMD Ryzen 7000 Series Socket AM5 ATX Motherboard Overview: MPG X670E CARBON WIFI Supports AMD Ryzen 7000 Series Desktop Processors Supports DDR5 Memory Enhanced Power Design: 18+2+1 Duet Rail Power System, Dual 8-pin CPU power connectors, Core Boost, Memory Boost Premium Thermal Solution: Extended Heatsink with Direct Touched Heat-pipe, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads and Double-sided M.2 Shield Frozr are built for high performance system and non-stop gaming experience High Quality PCB: 8-layer PCB made by 2oz thickened copper and server grade level material DIY Friendly Design: Patented Screwless M.2 Shield Frozr, EZ M.2 Clips, Smart Button, Pre-installed I/O Shield, Steel Armor Lightning Fast Game experience: PCIe 5.0 slots, Lightning Gen 5 x4 M.2, USB 3.2 Gen 2×2 2.5G LAN and Wi-Fi 6E Solution: Upgraded network solution for professional and multimedia use. Delivers a secure, stable and fast network connection MYSTIC LIGHT: 16.8 million colors / fancy lighting effects controlled in one click. MYSTIC LIGHT SYNC supports latest ARGB Gen2 strips, RGB strips and Ambient devices AUDIO BOOST 5: Reward your ears with studio grade sound quality for the most immersive gaming experience Specifications: Product Code MPGX670ECARBONWIFI CHIPSET AMD X670 CPU SUPPORT Supports AMD Ryzen 7000 Series Desktop Processors Socket AM5 MEMORY 4x DDR5, Maximum Memory Capacity 128GB ONBOARD GRAPHICS 1x HDMI Support HDMI 2.1 FRL, maximum resolution of 4K 120Hz 1x Display Port Support DP 1.4, maximum resolution of 4K 60Hz 1x Type-C Display port Supports DisplayPort 1.4 with HBR3, maximum resolution of 4K 120Hz *Available only on processors featuring integrated graphics. Graphics specifications may vary depending on the CPU installed. EXPANSION SLOT 3x PCI-E x16 slot Supports x16/x0/x4, x8/x8/x4 PCI_E1 PCIe 5.0 supports up to x16 (From CPU) PCI_E2 PCIe 5.0 supports up to x8 (From CPU) PCI_E3 PCIe 4.0 supports up to x4 (From Chipset) MULTI-GPU Supports AMD MULTI-GPU STORAGE 4x M.2 slot M.2_1 (From CPU) supports up to PCIe 5.0 x4, supports 2280/2260 devices M.2_2 (From CPU) supports up to PCIe 5.0 x4, supports 2280/2260 devices M.2_3 (From Chipset) supports up to PCIe 4.0 x4, supports 22110/2280/2260 devices M.2_4 (From Chipset) supports up to PCIe 4.0 x4, supports 2280/2260 devices 6x SATA 6G port RAID Supports RAID 0, RAID 1, and RAID 10 for SATA storage devices Supports RAID 0, RAID 1, and RAID 10 for M.2 NVMe storage devices LAN Realtek RTL8125BG 2.5Gbps LAN WIRELESS / BLUETOOTH AMD Wi-Fi 6E The Wireless module is pre-installed in the M.2 (Key-E) slot Supports 20MHz, 40MHz, 80MHz, 160MHz bandwidth in 2.4GHz/ 5GHz or 6GHz* bands Supports 802.11 a/ b/ g/ n/ ac/ ax Supports Bluetooth 5.2 * Wi-Fi 6E 6GHz may depend on every country’s regulations and will be ready in Windows 10 build 21H1 and Windows 11. ** Bluetooth 5.2 will be ready in Windows 10 build 21H1 and Windows 11. USB 2x USB 2.0 ports (Rear) 4x USB 2.0 ports (Front) 4x USB 3.2 Gen1 Type A ports (Front) 6x USB 3.2 Gen2 Type A ports (Rear) 1x USB 3.2 Gen2 Type C ports (Rear) 1x USB 3.2 Gen2 Type C ports (Front) 1x USB 3.2 Gen2x2 Type C ports (Rear) AUDIO Realtek ALC4080 Codec 7.1-Channel High Definition Audio Supports S/PDIF output Supports up to 32-Bit/384 kHz playback on front panel INTERNAL I/O 1x Power Connector(ATX_PWR) 2x Power Connector(CPU_PWR) 1x CPU Fan 1x Pump Fan 5x System Fan 2x Front Panel (JFP) 1x Chassis Intrusion (JCI) 1x Front Audio (JAUD) 1x Thermal Sensor connectors(T_SEN) 1x Tuning Controller connector(JDASH) 2x Addressable V2 RGB LED connector (JARGB_V2) 1x RGB LED connector(JRGB) 4x USB 2.0 ports 4x USB 3.2 Gen1 Type A ports 1x USB 3.2 Gen2 Type C ports LED FEATURE 1x EZ LED Control switch 4x EZ Debug LED 1x 2-Digit Debug Code LED BACK PANEL PORTS Clear CMOS Button Flash BIOS Button DisplayPort USB 2.0 2.5G LAN Audio Connectors Smart Button HDMI USB 3.2 Gen 2 10Gbps (Type-C Display port) USB 3.2 Gen 2 10Gbps (Type-A) USB 3.2 Gen 2×2 20Gbps (Type-C) Wireless / Bluetooth S/PDIF-Out OPERATING SYSTEM Support for Windows 11 64-bit, Windows 10 64-bit PCB DIMENSION ATX 304.8mmx243.84mm

Description Gigabyte Aorus Elite V2 B550 AMD Socket AM4 ATX Motherboard b'/xc2/xa0' UNPARALLELED PERFORMANCE GIGABYTE realize that customer won’t stop chasing a better computing performance. We take care of it and implement on products. Protective and optimized memory trace enhance the performance. Faster read and write are needed to save time and improve efficiency. We offer plenty of M.2 storage with thermal guards to ensure unthrottled read and write. In advance, adopting PCIe 4.0 ready components get the B550 motherboards easier to upgrade. b'/xc2/xa0' ADVANCED THERMAL SOLUTION b'/xc2/xa0' Unthrottled performance is guaranteed by the advanced thermal solution which including Enlarged Heatsinks, High Quality Thermal Conductivity Pads and Thermal Guards. B550 motherboards are cool on MOSFETs and M.2 SSDs even on full loading. It provides lower temperatures for enthusiasts, overclockers and professional gamers. b'/xc2/xa0' NEXT GENERATION CONNECTIVITY b'/xc2/xa0' A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. B550 AORUS motherboards provide all next generation network, storage, and WIFI connectivity to keep you up to speed.

The MSI MPG Z790 CARBON WIFI employs a carbon black colour scheme and RGB lighting to show off different personalities and identities. The MPG series brings out fashionable products by showing extremely unique styles and expressing a conceited attitude towards the challenge of the gaming world. With extraordinary performance and style, the MPG series defines the future of gaming fashion. The Z790 offers a huge step of DDR performance enhancement with the latest DDR5 memory. Combines with a dedicated SMT welding process and MSI Memory Boost technology, MPG Z790 CARBON WIFI is ready to deliver world-class memory performance. MSI motherboards let you manage speeds and temperatures for all your system and CPU fans in BIOS and software with a simplified graphical interface. You can also set up to 4 temperature targets, which will adjust the fan speeds automatically. Unleash and sustain maximum performance with a flagship VRM design built with a total of Direct 19+1+1 Power Phases. Combining dual power connectors and 105A Smart Power Stage, MPG Z790 CARBON WIFI is ready for the challenge of high-end processors. MSI MPG series motherboards support all the latest storage standards, which allows users to connect any ultra-fast storage device. Start games faster, load levels faster and have a real advantage over your enemies. Using USB 3.2 devices has never been faster! MPG Z790 series motherboards offer a wide variety of options to connect and boost your USB devices, offering never before seen USB speeds up to 20Gb/s when connecting the Rear USB Type-C. Designed to support the most popular All-In-One & customized water cooling solutions on the market. A dedicated water pump PIN header supports up to 3 amp, giving you full control of the water pump speed. A clearly marked ‘keep-out-zone’ allows for easy and safe installation and a perfect fit. FEATURES: Supports 13th /12th Gen Intel® Core™ / Pentium® / Celeron® processors for LGA 1700 socket Supports DDR5 Memory, up to 7600+(OC) MHz Lightning Fast Game experience: PCIe 5.0 slot, Lightning Gen 5 x4 M.2, USB 3.2 Gen 2×2 Enhanced Power Design: Direct 19+1+1 phases power, Core Boost, Memory Boost Premium Thermal Solution: Enlarged heatsink with heat-pipe, MOSFET thermal pads rated for 7W/mk Additional choke thermal pads and M.2 Shield Frozr are built for high-performance systems 2.5G LAN and Intel Wi-Fi 6E Solution: Upgraded network solution for professional and multimedia use Audio Boost 5: Reward your ears with the studio-grade sound quality for the most immersive gaming experience High-Quality PCB: 8-layer PCB made by server-grade level material Pre-installed I/O Shield: Better EMI protection and more convenience for installation SPECIFICATIONS: Socket: 1700 CPU (Max Support): Supports 12th/13th Gen Intel® Core™ Processors, Pentium® Gold and Celeron® Processors Chipset: Intel® Z790 Chipset DDR5 Memory: 7600+(OC)/ 7400 (OC)/ 7200(OC)/ 7000(OC)/ 6800(OC)/ 6600(OC)/ 6400(OC)/ 6200(OC)/ 6000(OC)/ 5800(OC)/ 5600(JEDEC)/ 5400(JEDEC)/ 5200(JEDEC)/ 5000(JEDEC)/ 4800(JEDEC) MHz Memory Channel: Dual DIMM Slots: 4 Max Memory (GB): 128 PCI-E x16: 2 PCI-E X1: 1 SATAIII: 6 M.2 Slot: 5 RAID: 0/1/5/10 LAN: 1x Intel® 2.5Gbps LAN Wireless/Bluetooth: Intel® Wi-Fi 6E USB 3.2 ports (Front): 1(Gen 2×2, Type-C), 2(Gen 1, Type A) USB 3.2 ports (Rear): 1(Gen 2×2, Type-C), 1(Gen 2, Type-C), 6(Gen 2, Type A), 2(Gen 1, Type A) USB 2.0 ports (Front): 4 Audio ports (Rear): Realtek® ALC4080 Codec HDMI: 1 DirectX: 12 Form Factor: ATX Operating System: Support for Windows® 11 64-bit, Windows® 10 64-bit WHAT’S IN THE BOX: MSI MPG Z790 CARBON WIFI DDR4 LGA1700 ATX Gaming Motherboard – Black x1 Wi-Fi Antenna x1 EZ M.2 Clips x4 USB Drive x1 SATA Cables x2 JARGB Extension Cable x1 JRGB Extension Cable(1 to 2) x1 Cable Stickers x1 Quick Installation Guide x1

The MSI MPG X670E CARBON WIFI lets you take a huge step forward in DDR performance enhancement with the latest DDR5 memory. Combining a dedicated SMT welding process and MSI Memory Boost technology, the MPG X670E CARBON WIFI is ready to deliver world-class memory performance. The MSI MPG series brings out fashionable products by showing extremely unique styles and expressing a conceited attitude towards the challenge of the gaming world. With extraordinary performance and style, the MPG series defines the future of gaming fashion. Unleash and sustain the maximum performance with a premium VRM design built with a total of 18+2+1 Duet Rail Power System(DRPS). Combining dual power connectors and Power Stage, MPG X670E CARBON WIFI is ready for the challenge of high-end processors. The PCB design has been optimized for higher bandwidth and faster transfer speeds, which is also beneficial for reliable circuit transmission. The patented design allows you to set your M.2 and Shield Frozr without the annoying screws, providing the easiest way for M.2 installation. Designed to support the most popular All-In-One & customized water cooling solutions on the market. A dedicated water pump PIN header supports up to 3 amp, giving you full control of the water pump speed. A clearly marked ‘keep-out-zone’ allows for easy and safe installation and a perfect fit. MSI motherboards let you manage speeds and temperatures for all your system and CPU fans in BIOS and software with a simplified graphical interface. You can also set up 4 temperature targets, which will adjust the fan speeds automatically. Connect and synchronize with MSI coolers and cases with strategically positioned pin-header locations including a dedicated pump-fan header. The MSI MPG X670E CARBON WIFI employs a carbon black colour scheme and RGB lighting to show off different personalities and identities. Splash on some colour and vibrant RGB lighting effects using MSI Mystic Light with 16.8 million colours and fancy LED effects. MSI Mystic Light provides you complete control of RGB lighting of your PC in one software. FEATURES: Supports AMD Ryzen™ 7000 Series Desktop Processors Supports DDR5 Memory, Dual Channel DDR5 6600+MHz (OC) Enhanced Power Design: 18+2+1 Duet Rail Power System, Dual 8-pin CPU power connectors, Core Boost, Memory Boost Premium Thermal Solution: Extended Heatsink with Direct Touched Heat-pipe, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads and Double-sided M.2 Shield Frozr High Quality PCB: 8-layer PCB made by 2oz thickened copper and server grade level material DIY Friendly Design: Patented Screwless M.2 Shield Frozr, EZ M.2 Clips, Smart Button, Pre-installed I/O Shield, Steel Armor Lightning Fast Game experience: PCIe 5.0 slots, Lightning Gen 5 x4 M.2, USB 3.2 Gen 2×2 2.5G LAN and Wi-Fi 6E Solution: Upgraded network solution for professional and multimedia use. Delivers a secure, stable and fast network connection Mystic Light: 16.8 million colors / fancy lighting effects controlled in one click. MYSTIC LIGHT SYNC supports latest ARGB Gen2 strips, RGB strips and Ambient devices Audio Boost: Reward your ears with studio grade sound quality for the most immersive gaming experience SPECIFICATIONS: Socket: AM5 CPU (Max Support): AMD Ryzen™ 7000 Series up to Ryzen 9 Chipset: AMD X670 DDR5 Memory: DDR5 6600+(OC)/6400(OC)/ 6200(OC)/6000(OC)/ 5800(OC)/ 5600(OC)/ 5400(OC)/ 5200(OC)/ 5000(OC)/ 4800(JEDEC) MHz Max. overclocking frequency: 1DPC 1R Max speed up to 6600+ MHz, 1DPC 2R Max speed up to 6000+ MHz, 2DPC 1R Max speed up to 6400+ MHz, 2DPC 2R Max speed up to 4000+ MHz Memory Channel: Dual Channel DDR5 DIMM Slots: 4 Max Memory (GB): 128 PCI-E x16: 3 (2 x PCIe 5.0 and 1 x PCIe 4.0) SATAIII: 6 M.2 Slot: 4 RAID: 0/1/10 LAN: 1x Realtek® RTL8125BG 2.5Gbps LAN Wi-Fi and Bluetooth: Intel® Wi-Fi 6E module USB 3.2 ports (Front): 1(Gen 2, Type-C), 4(Gen 1, Type A) USB 3.2 ports (Rear): 1(Gen 2×2, Type-C), 1(Gen 2, Type-C), 6(Gen 2, Type A) USB 2.0 ports (Front): 4 USB 2.0 ports (Rear): 2 Audio ports (Rear): 7.1 Channel HD Audio (Realtek® ALC4080 Codec) Type-C Display Port: 1 DisplayPort: 1 HDMI: 1 DirectX: 12 Form Factor: ATX Operating System: Support for Windows® 11 64-bit and Windows® 10 64-bit WHAT’S IN THE BOX: MSI MPG X670E CARBON WIFI AMD AM5 ATX Motherboard – Black x1 Wi-Fi Antenna x1 SATA cables x2 EZ M.2 Clip x3 USB Drive x1 1 to 2 RGB LED Extension Y Cable x1 Rainbow RGB LED Extension Cable x1 Quick Install Guide x1

Intel Mini PC - NUC Kit DETYKHE         The Intel® NUC Kit DETYKHE, built with an Intel® Atom™ processor for intelligent systems, is a pint-sized powerhouse for value-conscious businesses and organizations. This low-cost, low-power solution introduces many firsts to the Intel NUC form-factor: fanless thermal solution for the ultimate silence and reliability, onboard flash storage for small-footprint software solutions, internal flat panel display connectivity for built-in screens, video graphics array (VGA) port for monitor compatibility in legacy installations, serial ports header for peripherals requiring the robustness of hardware handshaking, watchdog timer for resilient system availability, and also inter-integrated circuit (I²C) and pulse width modulation (PWM) signals for interfacing with sensors and other embedded devices enabling the Internet of Things. And with its three-year supply availability, the Intel NUC Kit DETYKHE will be around to support long development and production ramp cycles. Specifications: Processor Intel® Atom  processor E GHz single core, 512 KB cache, 5 W thermal design power (TDP))   Memory DDR3L SO-DIMM 1.35V, MHz (down clocked to MHz), 8 GB maximum   Graphics Intel® HD Graphics (up to 400 MHz) 1x HDMI* 1.4a 1x Embedded DisplayPort* (eDP) 1.3 (2 lanes with backlight and adjustable voltage/timings) 1x VGA   Audio Multi-channel digital audio via HDMI interface Back panel headphone/microphone jack   Peripheral connectivity 1x USB 3.0 connector on the front panel 2x USB 2.0 connectors on the back panel 3x internal USB 2.0 ports (2x5 + 1x5 headers)   Storage 4-GB eMMC storage device built in Internal support for 2.5-inch HDD or SSD (up to 9.5mm thickness)   Networking Mbps Ethernet port Half-length PCIe* mini-card slot and wireless antennas pre-assembled (for wireless card support)   Enclosure Metallic gray plastic ring with black sides Dimensions: 190mm x 116mm x 40mm   Power adapter 12V, 36W wall-mount AC-DC power adapter  (power adapter not included)  (V DC back panel power connector) Multi-country plugs (IEC types A/C/G/I)   Warranty 3-year limited warranty

Asus Z170 Intel LGA1151 DDR4 ATX Motherboard Spesifications: - CPU Intel® Socket 775 for 6th Generation Core i7/Core i5/Core i3/Pentium®/Celeron® Processors Supports Intel® 14 nm CPU Supports Intel® Turbo Boost Technology 2.0 * The Intel® Turbo Boost Technology 2.0 support depends on the CPU types. * Refer to www.asus.com for CPU support list - Chipset Intel® 760G (780L) - Memory 0 x DIMM, Max. 4GB, DDR2 2400/2133 MHz Non-ECC, Un-buffered Memory Single Channel Memory Architecture Supports Intel® Extreme Memory Profile (XMP) * Hyper DIMM support is subject to the physical characteristics of individual CPUs. * Refer to www.asus.com for the Memory QVL (Qualified Vendors Lists). - Graphic Integrated Graphics Processor Multi-VGA output support: HDMI/DisplayPort ports - Supports HDMI with max. resolution 4096 x 2160 @ 24 Hz / 2560 x 1600 @ 60 Hz - Supports DisplayPort with max. resolution 4096 x 2160 @ 24 Hz / 3840 x 2160 @ 60 Hz Maximum shared memory of 1024 MB Supports Intel® InTru 3D, Quick Sync Video, Clear Video HD Technology, Insider DP 1.2 Multi-Stream Transport compliant, supports DP 1.2 monitor daisy chain up to 3 displays - Multi-GPU Support Supports NVIDIA® Quad-GPU SLI Technology Supports NVIDIA® 2-Way SLI Technology Supports AMD Quad-GPU CrossFireX Technology Supports AMD 3-Way CrossFireX Technology - Expansion Slots 0 x PCIe 3.0/2.0 x1 (x16 or dual x16 or x16/x8/x16 or x16/x8/x8/x8) 0 x PCIe 3.0/2.0 x1 (x16 or dual x16 or x16/x8/x16 or x16/x8/x8/x8) 0 x PCIe 3.0/2.0 x1 - Storage AMD SB710 controller: 0 x SATA 3Gb/s port(s), 0 x SATA 3Gb/s port(s), 0 x SATA 3Gb/s port(s), Support Raid 0, 1, 5, 10 Support Intel® Smart Response Technology on 2nd generation Intel® Core processor family Support Intel® Smart Response Technology on 2nd generation Intel® Core processor family AMD SB710 controller: 0 x SATA 3Gb/s port(s),, - LAN Realtek®, 0 x 10/100 LAN Controller(s) Realtek®, 0 x 10/100 LAN Gigabit Intel® LAN Connection- 802.3az Energy Efficient Ethernet (EEE) appliance ASUS Turbo LAN Utility ASUS LAN Guard - Audio AD1988B 5.1-channel High Definition Audio CODEC - Supports: Multi-streaming, Front Panel MIC Jack-retasking - High quality 112 dB SNR stereo playback output (Line-out at rear) and 104 dB SNR stereo playback input (Line-out at rear) Audio Feature: - Optical S/PDIF out port(s) at back panel - BD Audio Layer Content Protection - Audio Shielding: Ensures precision analog/digital separation and greatly reduced multi-lateral interference - Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals - Audio amplifier: Provides the highest-quality sound for headphone and speakers - Unique de-pop circuit: Reduces start-up popping noise to audio outputs - Top notch audio sensation delivers according to the audio configuration - Absolute Pitch 192khz/24bit true BD lossless sound Separate layer for left and right track, ensuring both sound deliver equal quality - USB Ports Built-in Controller: 0 x USB port(s) (0 at back panel, blue, 0 at mid-board) Built-in Controller: 0 x USB port(s) (0 at back panel, black, 0 at mid-board) Built-in Controller: 0 x USB port(s) (0 at back panel, teal blue,) Built-in Controller: 0 x USB port(s) (0 at back panel,,, Reversible) - Special Features OC Design - ASUS PRO Clock Technology - Full BCLK range for extreme overclocking performance TUF Features: TUF ENGINE! Power Design: - 8 +4 Digital Phase Power Design - TUF Components (New Alloy Choke, Ti-Cap. & MOSFET; certified by military-standard) - ASUS DIGI+ Power Control Utility Ultimate COOL! Thermal Solution: - TUF Thermal Armor with Flow Valve - TUF Thermal Radar 2 with Thermistors - TUF ICe Safe & Stable! Guardian Angel: "We Got Your Back!" Shape Force - TUF Fortifier - Dust Defenders with connector covers and back I/O dust filter - TUF ESD Guards 2 ASUS Exclusive Features: - GPU Boost - USB BIOS Flashback - MemOK! - AI Suite 3 - Ai Charger - Ai Charger+ - M.2 & SATA Express - Anti-Surge - Front Panel USB 3.0 Support - ASUS UEFI BIOS EZ Mode featuring friendly graphics user interface - USB 3.1 Boost - Disk Unlocker - Turbo LAN - PC Cleaner ASUS EZ DIY: - ASUS CrashFree BIOS 3 - ASUS EZ Flash 3 - ASUS USB BIOS Flashback - ASUS UEFI BIOS EZ Mode - Multi-language BIOS ASUS Q-Design: - ASUS Q-Shield - ASUS Q-LED (CPU, DRAM, VGA, Boot Device LED, HDD LED) - ASUS Q-Slot - ASUS Q-DIMM - ASUS Q-Connector Overclocking Protection: - ASUS C.P.R.(CPU Parameter Recall) - Operating System Support Windows® 10 Windows® 8.1 Windows® 7 - Back I/O Ports 0 x DisplayPort 0 x HDMI 0 x LAN (RJ45) port(s) 0 x USB 3.1 Gen 2 () 0 x USB 3.1 0 x USB 2.0 0 x USB 3.1 Gen 1 () (one port can be switched to USB BIOS Flashback) 0 x Optical S/PDIF out 0 x Audio jack(s) 0 x USB BIOS Flashback Button(s) 0 x 8-channel Audio I/O 0 x TUF Detective USB port - Internal I/O Ports 0 x AAFP connector 0 x USB 3.1 Gen 1 connector(s) support(s) additional 0 USB 3.1 Gen 1 port(s) (19-pin, moss green) 0 x USB 2.0 connector(s) support(s) additional 0 USB 2.0 port(s) 0 x SATA Express connector:, 0 x M.2 Socket 3 0 x SATA 6Gb/s connector(s) 0 x CPU Fan connector(s) (4 -pin) 0 x CPU OPT Fan connector(s) (4 -pin) 0 x Chassis Fan connector(s) (4 -pin) 0 x Assistant Fan connector(s) (0 x 3 -pin, [White]) 0 x S/PDIF out header(s) 0 x Thunderbolt header(s) 0 x 24-pin EATX Power connector(s) 0 x 8-pin ATX 12V Power connector(s) 0 x System panel(s) (Q-Connector) 0 x 5-pin EXT_FAN(Extension Fan) connector 0 x Chassis Intrusion connector(s) 0 x DRCT header(s) 0 x MemOK! button(s) 0 x Thermal sensor connector(s) 0 x CPU OV 0 x Clear CMOS jumper(s) 0 x Water Pump header (4-pin) 0 x 14-1 pin TPM connector - BIOS 128 Mb Flash ROM, UEFI AMI BIOS, PnP, DMI3.0, WfM2.0, SM BIOS 3.0, ACPI 5.0, Multi-language BIOS, ASUS EZ Flash 3, CrashFree BIOS 3, F11 EZ Tuning Wizard, F6 Qfan Control, F3 My Favorites, Quick Note, Last Modified log, F12 PrintScreen and ASUS DRAM SPD (Serial Presence Detect) memory information - Manageability WfM 2.0, DMI 3.0, WOL by PME, PXE - Form Factor ATX Form Factor 12 inch x 9.6 inch (30.5 cm x 24.4 cm) - Note *1: The PCIe x16_3 slot shares bandwidth with SATA6G_56. The PCIe x16_3 is default set at x2 mode. Supports Intel® RST for PCIE RAID storage. *2: The M.2 socket shares SATA ports with SATA Express_1 port. Adjust BIOS settings to use an M.2 SATA device. *3: Supports PCIE RAID configurations via onboard M.2 and PCIEX16_3 slot storages. *4: These functions will work depending on the CPU installed. *5: These SATA ports are for data hard drivers only. ATAPI devices are not supported. *** Confirm availability before placing order ***

We are currently closed until 9 January. Your order will be processed as soon as we re-open Item is expected to be in stock, however stock levels are LOW, so stock may be finished. If ordered, we will contact you if this product is sold out FEATURES BP671 8.2L Small Form Factor The BP Series was designed to offer quick integration. No peripheral carrier or bezel must be removed for assembly. This allows really quick assembly and reduces costs. Easy Integration The BP Series was designed to offer quick integration. No peripheral carrier or bezel need be removed for assembly. This allows really quick assembly and reduces costs.   Antenna Mount Ready for WLAN Card Supports Mini-ITX Motherboards Supports Mini-ITX motherboards for a wide choice of system features and price points.   Standard TFX 12V Power Supply Internal TFX 200W Power supply equipped with a temperature control sensor that reduces noise and allows quiet operation. Standard Components The BP Series supports standard size components (5.25" & 3.5"). The use of standard components helps to maximize configuration choices and minimize product costs.   Tool-Free Optional screwless design on the ODD bay and side panel for easy assembly. Optimal Thermal Performance An ultra silent 80mm case fan with Intel Thermally Advantaged Small Chassis 1.0 vents improve the airflow and optimize thermal performance, keeping temperatures below 102.2°F (39°C).  Excellent Thermal Solution 80x80x25mm System Fan Intel Thermally Advantaged Small Chassis 1.0 Vents Keeps temperatures below 39°C Optional Removable Air Filter   System Acoustic Result System Run Sound Pressure Idle 29.2dB Max Power (CPU 100%) 33.4dB System Thermal Result CPU Ambient Average Temperature 101°F (38.4°C) CPU Core™ 2 Duo E6550 2.33GHz (65W) Ambience Temperature 35°C (95°F) Ta Average 34.6 (94°F) Host Bridge 123°F (50.7°C) RAM 119°F (48.3°C) ODD 117°F (47.2°C) HDD 123°F (50.5°C) PSU Fan inside 110°F (43.6°C) PSU Fan outside 118°F (47.7°C) Second Fan inside 110°F (43.6°C) Second Fan outside 112°F (44.3°C) Lab Test: Intel Box CPU (Intel Core™ 2 Duo E6550 / 2.33GHz, LGA 775, 65W). + Source from In Win lab. All examined sources are subject to change at anytime, without prior notice. + Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of In Win products as measured by those tests. Any difference in system hardware, software design, or configuration may affect actual performance.  Front Ports USB 2.0 x 2 HD Audio x 1 Optional IEEE 1394 Optional USB 3.0 x 2   Rear Ports eSATA x 1 (at Rear Panel with Module) USB2.0 x 2 (at Rear Panel with Module) Universal Antenna Modules (UAMs) Mounting Hole Ready Security Padlock Loop Kensington Slot Supports 2.5" x 2    Optional Chassis Intrusion Switch Screwless ODD Bay Clips Screwless Top Cover Clips 3.5" to 2.5" HDD/SSD Bracket Optional 60mm Fan x 1  (60 x 60 x 10mm, 2500RPM, 20dB Fan, 4-Pin Power Connector)  PRODUCT SPECIFICATIONS

Intel Core i9-14900K LGA 1700 up to 6.0GHz 24 Core (8P+16E) 36MB Smart Cache 14th gen Processor Specifications: Product Code BX8071514900K Essentials Product Collection Intel Core i9 Processors (14th gen) Code Name Products formerly RAPTOR LAKE Vertical Segment Desktop Processor Number i9-14900K Lithography Intel 7 Use Conditions PC/Client/Tablet, Workstation CPU Specifications Total Cores 24 # of Performance-cores 8 # of Efficient-cores 16 Total Threads 32 Max Turbo Frequency 6 GHz Intel Thermal Velocity Boost Frequency 6 GHz Intel Turbo Boost Max Technology 3.0 Frequency 5.8 GHz Performance-core Max Turbo Frequency 5.6 GHz Efficient-core Max Turbo Frequency 4.4 GHz Performance-core Base Frequency 3.2 GHz Efficient-core Base Frequency 2.4 GHz Cache 36 MB Intel Smart Cache Total L2 Cache 32 MB Processor Base Power 125 W Maximum Turbo Power 253 W Supplemental Information Marketing Status Launched Launch Date Q4’23 Embedded Options Available No Memory Specifications Max Memory Size (dependent on memory type) 192 GB Memory Types Up to DDR5 5600 MT/s Up to DDR4 3200 MT/s Max # of Memory Channels 2 Max Memory Bandwidth 89.6 GB/s ECC Memory Supported Yes GPU Specifications Processor Graphics Intel UHD Graphics 770 Graphics Base Frequency 300 MHz Graphics Max Dynamic Frequency 1.65 GHz Graphics Output eDP 1.4b, DP 1.4a, HDMI 2.1 Execution Units 32 Max Resolution (HDMI) 4096 x 2160 @ 60Hz Max Resolution (DP) 7680 x 4320 @ 60Hz Max Resolution (eDP – Integrated Flat Panel) 5120 x 3200 @ 120Hz DirectX* Support 12 OpenGL* Support 4.5 OpenCL* Support 3 Multi-Format Codec Engines 2 Intel Quick Sync Video Yes Intel Clear Video HD Technology Yes # of Displays Supported 4 Device ID 0xA780 Expansion Options Direct Media Interface (DMI) Revision 4 Max # of DMI Lanes 8 Scalability 1S Only PCI Express Revision 5.0 and 4.0 PCI Express Configurations Up to 1×16+4, 2×8+4 Max # of PCI Express Lanes 20 Package Specifications Sockets Supported FCLGA1700 Max CPU Configuration 1 Thermal Solution Specification PCG 2020A T JUNCTION 100°C Package Size 45.0 mm x 37.5 mm Advanced Technologies Intel Gaussian b'&' Neural Accelerator 3 Intel Thread Director Yes Intel Deep Learning Boost (Intel DL Boost) on CPU Yes Intel Speed Shift Technology Yes Intel Adaptive Boost Technology Yes Intel Thermal Velocity Boost Yes Intel Turbo Boost Max Technology 3.0 Yes Intel Turbo Boost Technology 2 Intel Hyper-Threading Technology Yes Intel 64 Yes Instruction Set 64-bit Instruction Set Extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2 Idle States Yes Enhanced Intel SpeedStep Technology Yes Thermal Monitoring Technologies Yes Intel Volume Management Device (VMD) Yes Security b'&' Reliability Intel Standard Manageability (ISM) Yes Intel Control-Flow Enforcement Technology Yes Intel AES New Instructions Yes Secure Key Yes Intel OS Guard Yes Execute Disable Bit Yes Intel Boot Guard Yes Mode-based Execute Control (MBEC) Yes Intel Virtualization Technology (VT-x) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel VT-x with Extended Page Tables (EPT) Yes

Description Gigabyte B760M DS3H DDR4 Intel Socket LGA 1700 mATX Motherboard b'/xc2/xa0' 6+2+1 Phases Hybrid Digital VRM Design 6+2+1 Phases Low RDS(on) MOSFETs Premium Choke and Capacitors to improve transient response and minimize oscillation GIGABYTE Ultra-Efficient M.2 Thermal Guard With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue. b'/xc2/xa0' SMART FAN 6 b'/xc2/xa0' Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface b'/xc2/xa0' PERSONALIZATION b'/xc2/xa0' GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality. b'/xc2/xa0' ULTRA DURABLE Q-Flash Plus Update the BIOS easily without installing the CPU, memory and graphics card. With GIGABYTE Q-Flash Plus, you don’t need to install the CPU, memory and graphics card nor enter the BIOS menu to flash the BIOS. Just download and save a new BIOS file (rename to gigabyte.bin) on the USB flash drive, then press the dedicated Q-Flash Plus button and you’re good to go! b'/xc2/xa0' Gigabyte B760M DS3H DDR4 Intel Socket LGA 1700 mATX Motherboard GA-B760M-DS3H-DDR4

Intel BXTS13X Liquid Cooling Thermal Solution Heat sink/Radiator for Socket LGA1150/ LGA2011 / LGA1366 / LGA1156 / LGA1155, Retail Box, 1 year Limited Warranty Product Overview Intel introduces its second generation liquid cooling solution with the BXTS13X. It uses patented technology to provide high performance cooling in an easy to install unit. The Intel BXTS13X consists of a combined heat sink with a liquid pump and a radiator. The heat sink is compatible with CPU¿s using the LGA 2011, LGA 1150, LGA 1155, LGA 1156 and LGA1366 sockets. The small unit circulates water keeping the CPU cool when it is idling and when it is under full load. It automatically adjusts the rate of cooling according to CPU temperature. Liquid cooling not only keeps the CPU cool it allows you to mount the high performance radiator and speed adjustable 120mm x 120mm high flow fan to ensure that the heat is directed outside your case. This helps to keep all of your other components cooler increasing reliability. The pre-filled and sealed unit requires no maintenance and has a MTBF of 50,000 hours. Specifications ¿ Stock Code BXTS13X ¿ Brand Name Intel ¿ Product Name Intel TS13X Liquid Cooling Solution ¿ Form Factor -Case Fan with Radiator ¿ Package Type Retail ¿ Connectors 4 Pin Fan Connector ¿ Fan Diameter -120mm ¿ Height Radiator and Fan 52mm ¿ Fan Speed Variable rpm ¿ Fan Bearing Type -Riffle Bearing ¿ Number of Fans 1 ¿ Rated Voltage 12 VDC ¿ Rated Wattage 2.4 Watts (min) ¿ Rated Amps.5 Amps ¿ Life 50000 hours ¿ Rated Air Flow 47.27 CFM ¿ Dimensions -Width 120mm x Depth120mm ¿ Weight (Approximate)820g Application/Usage Intel CPU Cooling ¿ LGA 2011 socket CPU's ¿ LGA 1150 socket CPU's ¿ LGA 1155 socket CPU's ¿ LGA 1156 socket CPU's ¿ LGA 1366 socket CPU's Package Contents ¿ 1 x 120 mm 7 Blade Fan ¿ 1 x Radiator and Cooler Pump Assembly ¿ 1 x 4 Pin Electrical Connector ¿ 1 x Set Fan/Radiator Mounting Hardware

Intel BXTS13X Liquid Cooling Thermal Solution Heat sink/Radiator for Socket LGA1150/ LGA2011 / LGA1366 / LGA1156 / LGA1155, Retail Box, 1 year Limited Warranty Product Overview Intel introduces its second generation liquid cooling solution with the BXTS13X. It uses patented technology to provide high performance cooling in an easy to install unit. The Intel BXTS13X consists of a combined heat sink with a liquid pump and a radiator. The heat sink is compatible with CPU’s using the LGA 2011, LGA 1150, LGA 1155, LGA 1156 and LGA1366 sockets. The small unit circulates water keeping the CPU cool when it is idling and when it is under full load. It automatically adjusts the rate of cooling according to CPU temperature. Liquid cooling not only keeps the CPU cool it allows you to mount the high performance radiator and speed adjustable 120mm x 120mm high flow fan to ensure that the heat is directed outside your case. This helps to keep all of your other components cooler increasing reliability. The pre-filled and sealed unit requires no maintenance and has a MTBF of 50,000 hours. Specifications • Stock Code BXTS13X • Brand Name Intel • Product Name Intel TS13X Liquid Cooling Solution • Form Factor -Case Fan with Radiator • Package Type Retail • Connectors 4 Pin Fan Connector • Fan Diameter -120mm • Height Radiator and Fan 52mm • Fan Speed Variable rpm • Fan Bearing Type -Riffle Bearing • Number of Fans 1 • Rated Voltage 12 VDC • Rated Wattage 2.4 Watts (min) • Rated Amps.5 Amps • Life 50000 hours • Rated Air Flow 47.27 CFM • Dimensions -Width 120mm x Depth120mm • Weight (Approximate)820g Application/Usage Intel CPU Cooling • LGA 2011 socket CPU's • LGA 1150 socket CPU's • LGA 1155 socket CPU's • LGA 1156 socket CPU's • LGA 1366 socket CPU's Package Contents • 1 x 120 mm 7 Blade Fan • 1 x Radiator and Cooler Pump Assembly • 1 x 4 Pin Electrical Connector • 1 x Set Fan/Radiator Mounting Hardware

Arctic Alpine 64 GT Rev.2 CPU Cooler - For AMD, 80mm, 25.6 CFM, RPM Product Overview Keep your system cool and stable at all times.   The Arctic Alpine 64 GT is a very cost-efficient cooler for AMD CPUs, offering ultra-quiet thermal solution for system builders. The user-friendly mounting system on the cooler is very easy to install.Equipped with high quality components such as an 80mm PWM fan and patented fan holder, the Alpine 64 GT offers a good cooling performance at a low noise level in a very competitive price range.The Alpine 64 GT maximizes the cooling performance and minimizes the noise level at the same time. Thanks to the patented fan holder, it just produces just 0.25 Sone noise while providing 70W of cooling capacity.With just two plugs on two opposite sides, the simple mounting system offers excellent stability and is applicable within minutes. The pre-applied ARCTIC MX-2 thermal compound makes the installation a quick and clean process.  Features •Ultra quiet 80mm PWM fan with low noise impeller •Optimised heat sink design •Patented fan holder eliminates the buzzing sounds •Pre-applied MX-2 •Fluid Dynamic Bearing •Easy Installation Specifications • Fan Type: CPU Cooler         • Fan Size:80mm         • Socket Type:,AM2,AM2+,AM3,FM1,FM2         • RPM: RPM         • Air Flow:25.6 CFM         • Current:0.16 A         • Heatsink Dimensions:87 L x 108 W x 74 mm

Stock Code: BXG StatusLaunched Launch DateQ2'14 Processor NumberG # of Cores2 # of Threads2 Clock Speed2.8 GHz Cache2 MB DMI25 GT/s Instruction Set64-bit Instruction Set ExtensionsSSE Embedded Options Available No Lithography22 nm Scalability1S Only Max TDP54 W Thermal Solution SpecificationPCG C -Memory Specifications Max Memory Size (dependent on memory type)32 GB Memory TypesDDR # of Memory Channels2 Max Memory Bandwidth21.3 GB/s ECC Memory Supported ‡ Yes -Graphics Specifications Processor Graphics ‡Intel® HD Graphics Graphics Base Frequency 350 MHz Graphics Max Dynamic Frequency1.05 GHz Graphics Video Max Memory1 GB Intel® Quick Sync Video Yes Intel® Clear Video HD TechnologyYes # of Displays Supported ‡3 -Expansion Options PCI Express Revision3.0 PCI Express Configurations ‡Up to 1x16, 2x8, 1x8/2x4 Max # of PCI Express Lanes16 -Package Specifications Max CPU Configuration1 TCASE72°C Package Size37.5mm x 37.5mm Graphics and IMC Lithography22 nm Sockets Supported FCLGA Low Halogen Options AvailableSee MDDS -Advanced Technologies Intel® Turbo Boost Technology ‡No Intel® vPro Technology ‡ No Intel® Hyper-Threading Technology ‡ No Intel® Virtualization Technology (VT-x) ‡ Yes Intel® Virtualization Technology for Directed I/O (VT-d) ‡ No Intel® VT-x with Extended Page Tables (EPT) ‡ Yes Intel® TSX-NINo Intel® 64 ‡ Yes Idle StatesYes Enhanced Intel SpeedStep® Technology Yes Thermal Monitoring TechnologiesYes Intel® Virtualization Technology for Itanium (VT-i)No Intel® Stable Image Platform Program (SIPP)No -Intel® Data Protection Technology AES New Instructions No Secure KeyYes -Intel® Platform Protection Technology Trusted Execution Technology ‡ No Execute Disable Bit ‡Yes

Stock Code: BXI StatusLaunched Launch DateQ2'13 Processor Numberi # of Cores2 # of Threads4 Clock Speed3.5 GHz Intel® Smart Cache3 MB DMI5 GT/s Instruction Set64-bit Instruction Set ExtensionsSSE, AVX Embedded Options Available No Lithography22 nm Max TDP55 W Thermal Solution SpecificationC -Memory Specifications Max Memory Size (dependent on memory type)32 GB Memory TypesDDR # of Memory Channels2 Max Memory Bandwidth25.6 GB/s ECC Memory Supported ‡ Yes -Graphics Specifications Processor Graphics ‡Intel® HD Graphics Graphics Base Frequency650 MHz Graphics Max Dynamic Frequency1.05 GHz Intel® Quick Sync Video Yes Intel® InTru™ 3D TechnologyYes Intel® Insider™Yes Intel® Wireless Display Yes Intel® Flexible Display Interface (Intel® FDI)Yes Intel® Clear Video HD TechnologyYes # of Displays Supported ‡3 -Expansion Options PCI Express Revision2.0 PCI Express Configurations ‡up to 1x16, 2x8, 1x8 & 2x4 -Package Specifications Max CPU Configuration1 TCASE65.3°C Package Size 37.5mm x 37.5mm Sockets SupportedFCLGA Low Halogen Options AvailableSee MDDS -Advanced Technologies Intel® Turbo Boost Technology ‡No Intel® vPro Technology ‡ No Intel® Hyper-Threading Technology ‡ Yes Intel® Virtualization Technology (VT-x) ‡ Yes Intel® Virtualization Technology for Directed I/O (VT-d) ‡ No Intel® VT-x with Extended Page Tables (EPT) ‡ Yes Intel® 64 ‡ Yes Intel® My WiFi TechnologyYes Idle StatesYes Enhanced Intel SpeedStep® Technology Yes Thermal Monitoring TechnologiesYes Intel® Identity Protection Technology ‡Yes -Intel® Data Protection Technology AES New Instructions No Secure KeyNo -Intel® Platform Protection Technology Trusted Execution Technology ‡ No Execute Disable Bit ‡Yes Anti-Theft Technology Yes

Stock Code: BXI StatusLaunched Launch DateQ2'14 Processor Numberi # of Cores4 # of Threads4 Clock Speed3.2 GHz Max Turbo Frequency3.4 GHz Intel® Smart Cache6 MB DMI25 GT/s # of QPI Links0 Instruction Set64-bit Instruction Set ExtensionsSSE , AVX 2.0 Embedded Options Available Yes Lithography 22 nm Scalability1S Only Max TDP84 W Thermal Solution SpecificationPCG D -Memory Specifications Max Memory Size (dependent on memory type) 32 GB Memory TypesDDR # of Memory Channels2 Max Memory Bandwidth25.6 GB/s ECC Memory Supported ‡ No -Graphics Specifications Processor Graphics ‡Intel® HD Graphics Graphics Base Frequency350 MHz Graphics Max Dynamic Frequency1.1 GHz Graphics Video Max Memory1 GB Intel® Quick Sync Video Yes Intel® InTru™ 3D TechnologyYes Intel® Insider™Yes Intel® Wireless Display Yes Intel® Clear Video HD TechnologyYes # of Displays Supported ‡3 -Expansion Options PCI Express Revision3.0 PCI Express Configurations ‡Up to 1x16, 2x8, 1x8/2x4 Max # of PCI Express Lanes16 -Package Specifications Max CPU Configuration1 TCASE°C Package Size37.5mm x 37.5mm Graphics and IMC Lithography22nm Sockets Supported FCLGA Low Halogen Options AvailableSee MDDS -Advanced Technologies Intel® Turbo Boost Technology ‡2.0 Intel® vPro Technology ‡ No Intel® Hyper-Threading Technology ‡ No Intel® Virtualization Technology (VT-x) ‡ Yes Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Yes Intel® VT-x with Extended Page Tables (EPT) ‡ Yes Intel® TSX-NINo Intel® 64 ‡ Yes Intel® My WiFi TechnologyYes Idle StatesYes Enhanced Intel SpeedStep® Technology Yes Thermal Monitoring TechnologiesYes Intel® Identity Protection Technology ‡Yes Intel® Stable Image Platform Program (SIPP)No -Intel® Data Protection Technology AES New Instructions Yes Secure KeyYes -Intel® Platform Protection Technology OS GuardYes Trusted Execution Technology ‡ No Execute Disable Bit ‡Yes Anti-Theft TechnologyYes

Stock Code: BXIK  StatusLaunched Launch DateQ2'14 Processor NumberiK # of Cores4 # of Threads4 Clock Speed3.5 GHz Max Turbo Frequency3.9 GHz Intel® Smart Cache6 MB DMI25 GT/s # of QPI Links0 Instruction Set64-bit Instruction Set ExtensionsSSE , AVX 2.0 Embedded Options Available No Lithography22 nm Scalability1S Only Max TDP88 W Thermal Solution SpecificationPCG D DatasheetLink -Memory Specifications Max Memory Size (dependent on memory type)32 GB Memory TypesDDR # of Memory Channels2 Max Memory Bandwidth25.6 GB/s ECC Memory Supported ‡ No -Graphics Specifications Processor Graphics ‡Intel® HD Graphics Graphics Base Frequency350 MHz Graphics Max Dynamic Frequency1.2 GHz Graphics Video Max Memory1.7 GB Intel® Quick Sync Video Yes Intel® InTru™ 3D TechnologyYes Intel® Insider™Yes Intel® Wireless Display Yes Intel® Flexible Display Interface (Intel® FDI)Yes Intel® Clear Video HD TechnologyYes # of Displays Supported ‡3 -Expansion Options PCI Express Revision3.0 PCI Express Configurations ‡Up to 1x16, 2x8, 1x8/2x4 Max # of PCI Express Lanes16 -Package Specifications Max CPU Configuration1 TCASE°C Package Size37.5mm x 37.5mm Graphics and IMC Lithography22nm Sockets SupportedFCLGA Low Halogen Options AvailableSee MDDS -Advanced Technologies Intel® Turbo Boost Technology ‡2.0 Intel® vPro Technology ‡ No Intel® Hyper-Threading Technology ‡ No Intel® Virtualization Technology (VT-x) ‡Yes Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Yes Intel® VT-x with Extended Page Tables (EPT) ‡ Yes Intel® TSX-NIYes Intel® 64 ‡ Yes Intel® My WiFi TechnologyYes Idle StatesYes Enhanced Intel SpeedStep® Technology Yes Thermal Monitoring TechnologiesYes Intel® Identity Protection Technology ‡Yes Intel® Stable Image Platform Program (SIPP)No -Intel® Data Protection Technology AES New Instructions Yes Secure KeyYes -Intel® Platform Protection Technology OS GuardYes Trusted Execution Technology ‡ No Execute Disable Bit ‡Yes Anti-Theft TechnologyYes

Stock Code: BXI StatusLaunched Launch DateQ2'14 Processor Numberi # of Cores4 # of Threads8 Clock Speed3.6 GHz Max Turbo Frequency4 GHz Intel® Smart Cache8 MB DMI25 GT/s # of QPI Links0 Instruction Set64-bit Instruction Set ExtensionsSSE , AVX 2.0 Embedded Options Available No Lithography 22 nm Scalability1S Only Max TDP84 W Thermal Solution SpecificationPCG D -Memory Specifications Max Memory Size (dependent on memory type) 32 GB Memory TypesDDR # of Memory Channels2 Max Memory Bandwidth25.6 GB/s ECC Memory Supported ‡ No -Graphics Specifications Processor Graphics ‡Intel® HD Graphics Graphics Base Frequency350 MHz Graphics Max Dynamic Frequency1.2 GHz Graphics Video Max Memory1 GB Intel® Quick Sync Video Yes Intel® InTru™ 3D TechnologyYes Intel® Insider™Yes Intel® Wireless Display Yes Intel® Clear Video HD TechnologyYes # of Displays Supported ‡3 -Expansion Options PCI Express Revision3.0 PCI Express Configurations ‡Up to 1x16, 2x8, 1x8/2x4 Max # of PCI Express Lanes16 -Package Specifications Max CPU Configuration1 TCASE°C Package Size37.5mm x 37.5mm Graphics and IMC Lithography22nm Sockets Supported FCLGA Low Halogen Options AvailableSee MDDS -Advanced Technologies Intel® Turbo Boost Technology ‡2.0 Intel® vPro Technology ‡ Yes Intel® Hyper-Threading Technology ‡ Yes Intel® Virtualization Technology (VT-x) ‡ Yes Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Yes Intel® VT-x with Extended Page Tables (EPT) ‡ Yes Intel® TSX-NIYes Intel® 64 ‡ Yes Intel® My WiFi TechnologyYes Idle StatesYes Enhanced Intel SpeedStep® Technology Yes Thermal Monitoring TechnologiesYes Intel® Identity Protection Technology ‡Yes Intel® Stable Image Platform Program (SIPP)Yes -Intel® Data Protection Technology AES New Instructions Yes Secure KeyYes -Intel® Platform Protection Technology OS GuardYes Trusted Execution Technology ‡ Yes Execute Disable Bit ‡Yes Anti-Theft TechnologyYes

Intel Core i5-6500 3.2 GHz Quad Core 14nm Skylake Socket 1151 Desktop CPU Specifications: Essentials: - Status Launched - Launch Date Q3'15 - Processor Number i5-6500 - Intel Smart Cache 6 MB - DMI3 8 GT/s - Instruction Set 64-bit - Instruction Set Extensions SSE4.1/4.2, AVX 2.0 - Embedded Options Available Yes - Lithography 14 nm - Scalability 1S Only - Thermal Solution Specification PCG 2015C (65W) Performance - # of Cores 4 - # of Threads 4 - Processor Base Frequency 3.2 GHz - Max Turbo Frequency 3.6 GHz - TDP 65 W Memory Specifications: - Max Memory Size (dependent on memory type) 64 GB - Memory Types DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V - Max # of Memory Channels 2 - Max Memory Bandwidth 34.1 GB/s - ECC Memory Supported No Graphics Specifications: - Processor Graphics Intel HD Graphics 530 - Graphics Base Frequency 350 MHz - Graphics Max Dynamic Frequency 1.05 GHz - Graphics Video Max Memory 1.7 GB - Graphics Output eDP/DP/HDMI/DVI - 4K Support Yes, at 60Hz - Max Resolution (Intel WiDi) 1080p - Max Resolution (HDMI 1.4) 4096x2304@24Hz - Max Resolution (DP) 4096x2304@60Hz - Max Resolution (eDP - Integrated Flat Panel) 4096x2304@60Hz - Max Resolution (VGA) N/A - DirectX* Support 12 - OpenGL* Support 4.4 - Intel Quick Sync Video Yes - Intel InTru 3D Technology Yes - Intel Insider Yes - Intel Wireless Display Yes - Intel Clear Video HD Technology Yes - Intel Clear Video Technology Yes - # of Displays Supported 3 - Device ID 0x1912 Expansion Options: - PCI Express Revision 3 - PCI Express Configurations Up to 1x16, 2x8, 1x8+2x4 - Max # of PCI Express Lanes 16 Package Specifications: - Max CPU Configuration 1 - Package Size 37.5mm x 37.5mm - Graphics and IMC Lithography 14 nm - Sockets Supported FCLGA1151 - Low Halogen Options Available See MDDS Advanced Technologies: - Intel Turbo Boost Technology 2 - Intel vPro Technology Yes - Intel Hyper-Threading Technology No - Intel Virtualization Technology (VT-x) Yes - Intel Virtualization Technology for Directed I/O (VT-d) Yes - Intel VT-x with Extended Page Tables (EPT) Yes - Intel TSX-NI Y Yes - Intel 64 Yes - Idle States Yes - Enhanced Intel SpeedStep Technology Yes - Thermal Monitoring Technologies Yes - Intel Stable Image Platform Program (SIPP) Yes - Intel Small Business Advantage Yes Intel Data Protection Technology: - Intel AES New Instructions Yes - Secure Key Yes Intel Platform Protection Technology: - OS Guard Yes - Trusted Execution Technology Yes - Execute Disable Bit Yes Warranty Information: - Warranty 3 Year Warranty *** Confirm availability before placing your order ***

Intel Alder Lake 12th gen i5-12400 up to 4.4GHz 6 Core Socket LGA 1700 7.5MB L2 Cache Processor Specifications: Product Code BX8071512400 Essentials Product Collection 12th Generation Intel Core i5 Processors Code Name Products formerly Alder Lake Vertical Segment Desktop Processor Number i5-12400 Status Launched Launch Date Q1’22 Lithography Intel 7 Use Conditions PC/Client/Tablet CPU Specifications Total Cores 6 # of Performance-cores 6 # of Efficient-cores 0 Total Threads 12 Max Turbo Frequency 4.40 GHz Performance-core Max Turbo Frequency 4.40 GHz Performance-core Base Frequency 2.50 GHz Cache 18 MB Intel Smart Cache Total L2 Cache 7.5 MB Processor Base Power 65 W Maximum Turbo Power 117 W Supplemental Information Embedded Options Available Yes Memory Specifications Max Memory Size (dependent on memory type) 128 GB Memory Types Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s Max # of Memory Channels 2 Max Memory Bandwidth 76.8 GB/s Processor Graphics Processor Graphics Intel UHD Graphics 730 Graphics Base Frequency 300 MHz Graphics Max Dynamic Frequency 1.45 GHz Graphics Output eDP 1.4b, DP 1.4a, HDMI 2.1 Execution Units 24 Max Resolution (HDMI) 4096 x 2160 @ 60Hz Max Resolution (DP) 7680 x 4320 @ 60Hz Max Resolution (eDP – Integrated Flat Panel) 5120 x 3200 @ 120Hz DirectX* Support 12 OpenGL* Support 4.5 Multi-Format Codec Engines 1 Intel Quick Sync Video Yes Intel Clear Video HD Technology Yes # of Displays Supported 4 Device ID 0x4692 / 0x4682 OpenCL* Support 2.1 Expansion Options Direct Media Interface (DMI) Revision 4 Max # of DMI Lanes 8 Scalability 1S Only PCI Express Revision 5.0 and 4.0 PCI Express Configurations Up to 1×16+4, 2×8+4 Max # of PCI Express Lanes 20 Package Specifications Sockets Supported FCLGA1700 Max CPU Configuration 1 Thermal Solution Specification PCG 2020C T JUNCTION 100°C Package Size 45.0 mm x 37.5 mm Advanced Technologies Intel Gaussian b'&' Neural Accelerator 3 Intel Thread Director No Intel Deep Learning Boost (Intel DL Boost) Yes Intel Optane Memory Supported Yes Intel Speed Shift Technology Yes Intel Turbo Boost Max Technology 3.0 No Intel Turbo Boost Technology 2 Intel Hyper-Threading Technology Yes Intel Virtualization Technology (VT-x) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel 64 Yes Instruction Set 64-bit Instruction Set Extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2 Idle States Yes Enhanced Intel SpeedStep Technology Yes Thermal Monitoring Technologies Yes Intel Volume Management Device (VMD) Yes Security b'&' Reliability Intel AES New Instructions Yes Secure Key Yes Intel OS Guard Yes Execute Disable Bit Yes Intel Boot Guard Yes Mode-based Execute Control (MBEC) Yes Intel Control-Flow Enforcement Technology Yes

Intel Alder Lake 12th gen i3-12100F up to 4.3GHz 4 Core Socket LGA 1700 5MB L2 Cache Processor Specifications: Product Code BX8071512100F Essentials Product Collection 12th Generation Intel Core i3 Processors Code Name Products formerly Alder Lake Vertical Segment Desktop Processor Number i3-12100F Status Launched Launch Date Q1’22 Lithography Intel 7 Use Conditions PC/Client/Tablet CPU Specifications Total Cores 4 # of Performance-cores 4 # of Efficient-cores 0 Total Threads 8 Max Turbo Frequency 4.30 GHz Performance-core Max Turbo Frequency 4.30 GHz Performance-core Base Frequency 3.30 GHz Cache 12 MB Intel Smart Cache Total L2 Cache 5 MB Processor Base Power 58 W Maximum Turbo Power 89 W Supplemental Information Embedded Options Available No Memory Specifications Max Memory Size (dependent on memory type) 128 GB Memory Types Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s Max # of Memory Channels 2 Max Memory Bandwidth 76.8 GB/s Expansion Options Direct Media Interface (DMI) Revision 4 Max # of DMI Lanes 8 Scalability 1S Only PCI Express Revision 5.0 and 4.0 PCI Express Configurations Up to 1×16+4, 2×8+4 Max # of PCI Express Lanes 20 Package Specifications Sockets Supported FCLGA1700, FCBGA1700 Max CPU Configuration 1 Thermal Solution Specification PCG 2020C T JUNCTION 100°C Package Size 45.0 mm x 37.5 mm Advanced Technologies Intel Gaussian b'&' Neural Accelerator 3 Intel Thread Director No Intel Deep Learning Boost (Intel DL Boost) Yes Intel Optane Memory Supported Yes Intel Speed Shift Technology Yes Intel Turbo Boost Max Technology 3.0 No Intel Turbo Boost Technology 2 Intel Hyper-Threading Technology Yes Intel Virtualization Technology (VT-x) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel 64 Yes Instruction Set 64-bit Instruction Set Extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2 Idle States Yes Enhanced Intel SpeedStep Technology Yes Thermal Monitoring Technologies Yes Intel Volume Management Device (VMD) Yes Security b'&' Reliability Intel AES New Instructions Yes Secure Key Yes Intel OS Guard Yes Execute Disable Bit Yes Intel Boot Guard Yes Mode-based Execute Control (MBEC) Yes Intel Control-Flow Enforcement Technology Yes

Intel Core i3 12100 3.3GHz 4 Core LGA 1700 Processor Specifications: Product Code BX8071512100 Essentials Product Collection 12th Generation Intel Core i3 Processors Code Name Products formerly Alder Lake Vertical Segment Desktop Processor Number i3-12100 Lithography Intel 7 Use Conditions PC/Client/Tablet CPU Specifications Total Cores 4 # of Performance-cores 4 # of Efficient-cores 0 Total Threads 8 Max Turbo Frequency 4.30 GHz Performance-core Max Turbo Frequency 4.30 GHz Performance-core Base Frequency 3.30 GHz Cache 12 MB Intel Smart Cache Total L2 Cache 5 MB Processor Base Power 60 W Maximum Turbo Power 89 W Supplemental Information Embedded Options Available No Memory Specifications Max Memory Size (dependent on memory type) 128 GB Memory Types Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s Max # of Memory Channels 2 Max Memory Bandwidth 76.8 GB/s Processor Graphics Processor Graphics Intel UHD Graphics 730 Graphics Base Frequency 300 MHz Graphics Max Dynamic Frequency 1.40 GHz Graphics Output eDP 1.4b, DP 1.4a, HDMI 2.1 Execution Units 24 Max Resolution (HDMI) 4096 x 2160 @ 60Hz Max Resolution (DP) 7680 x 4320 @ 60Hz Max Resolution (eDP – Integrated Flat Panel) 5120 x 3200 @ 120Hz DirectX* Support 12 OpenGL* Support 4.5 Multi-Format Codec Engines 1 Intel Quick Sync Video Yes Intel Clear Video HD Technology Yes # of Displays Supported 4 Device ID 0x4692 OpenCL* Support 2.1 Expansion Options Direct Media Interface (DMI) Revision 4 Max # of DMI Lanes 8 Scalability 1S Only PCI Express Revision 5.0 and 4.0 PCI Express Configurations Up to 1×16+4, 2×8+4 Max # of PCI Express Lanes 20 Package Specifications Sockets Supported FCBGA1700, FCLGA1700 Max CPU Configuration 1 Thermal Solution Specification PCG 2020C TJUNCTION 100°C Package Size 45.0 mm x 37.5 mm Advanced Technologies Intel Gaussian b'&' Neural Accelerator 3 Intel Thread Director No Intel Deep Learning Boost (Intel DL Boost) Yes Intel Optane Memory Supported Yes Intel Speed Shift Technology Yes Intel Turbo Boost Max Technology 3.0 No Intel Turbo Boost Technology 2 Intel Hyper-Threading Technology Yes Intel Virtualization Technology (VT-x) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel 64 Yes Instruction Set 64-bit Instruction Set Extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2 Idle States Yes Enhanced Intel SpeedStep Technology Yes Thermal Monitoring Technologies Yes Intel Volume Management Device (VMD) Yes Security b'&' Reliability Intel AES New Instructions Yes Secure Key Yes Intel OS Guard Yes Execute Disable Bit Yes Intel Boot Guard Yes Mode-based Execute Control (MBEC) Yes Intel Control-Flow Enforcement Technology Yes